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| 1. general description the SA58632 is a two-channel audio ampli?er in an hvqfn20 package. it provides power output of 2.2 w per channel with an 8 w load at 9 v supply. the internal circuit is comprised of two btl (bridge-tied load) ampli?ers with a complementary pnp-npn output stage and standby/mute logic. the SA58632 is housed in a 20-pin hvqfn package, which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation. 2. features n low junction-to-ambient thermal resistance using exposed die attach paddle n gain can be ?xed with external resistors from 6 db to 30 db n standby mode controlled by cmos-compatible levels n low standby current < 10 m a n no switch-on/switch-off plops n high power supply ripple rejection: 50 db minimum n electrostatic discharge (esd) protection n output short circuit to ground protection n thermal shutdown protection 3. applications n professional and amateur mobile radio n portable consumer products: toys and games n personal computer remote speakers SA58632 2 2.2 w btl audio ampli?er rev. 01 27 june 2006 product data sheet
SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 2 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 4. quick reference data [1] with a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the dc output offset voltage divided by r l . [2] supply voltage ripple rejection is measured at the output with a source impedance of r s =0 w at the input. the ripple voltage is a sine wave with a frequency of 1 khz and an amplitude of 100 mv (rms), which is applied to the positive supply rail. [3] supply voltage ripple rejection is measured at the output, with a source impedance of r s =0 w at the input. the ripple voltage is a sine wave with a frequency between 100 hz and 20 khz and an amplitude of 100 mv (rms), which is applied to the positive supply rail. 5. ordering information table 1. quick reference data v cc =6v;t amb =25 c; r l =8 w ;v mode = 0 v; measured in test circuit figure 3 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc supply voltage operating 2.2 9 18 v i q quiescent current r l = w [1] -1522ma i stb standby current v mode =v cc --10 m a p o output power thd+n = 10 % 1.2 1.5 - w thd+n = 0.5 % 0.9 1.1 - w thd+n = 10 %; v cc =9v - 2.2 - w thd+n total harmonic distortion-plus-noise p o = 0.5 w - 0.15 0.3 % psrr power supply rejection ratio [2] 50 - - db [3] 40 - - db table 2. ordering information type number package name description version SA58632bs hvqfn20 plastic thermal enhanced very thin quad ?at package; no leads; 20 terminals; body 6 5 0.85 mm sot910-1 SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 3 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 6. block diagram fig 1. block diagram of SA58632 SA58632 v ccl outl - inl+ inl - rgnd outl+ 002aac078 15 14 r 20 k w 20 k w 16 standby/mute logic 1 7 r v ccl 17 v ccr 10 v ccr outr - inr+ inr - svr outr+ 12 13 r 20 k w 20 k w 3 11 standby/mute logic 6 r mode 2 btl/se 4 lgnd 20 gnd 18 gnd 19 gnd 9 gnd 8 n.c. 5 SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 4 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 7. pinning information 7.1 pinning 7.2 pin description [1] pins 8, 9, 18 and 19 are connected to the lead frame and also to the substrate. they may be kept ?oating. when connected to the ground plane, the pcb can be used as heatsink. fig 2. pin con?guration for hvqfn20 002aac079 outr - n.c. inr+ btl/se inl+ svr outl - outl+ transparent top view 11 inr - 12 inl - 15 5 13 4 3 mode 2 outr+ 6 16 1 terminal 1 index area SA58632bs 14 v ccl gnd lgnd gnd 19 17 20 18 v ccr gnd rgnd gnd 8 10 7 9 table 3. pin description symbol pin description outl+ 1 positive loudspeaker terminal, left channel mode 2 operating mode select (standby, mute, operating) svr 3 half supply voltage, decoupling ripple rejection btl/se 4 btl loudspeaker or se headphone operation n.c. 5 not connected outr+ 6 positive loudspeaker terminal, right channel rgnd 7 ground, right channel gnd 8, 9, 18, 19 ground [1] v ccr 10 supply voltage; right channel outr - 11 negative loudspeaker terminal, right channel inr - 12 negative input, right channel inr + 13 positive input, right channel inl+ 14 positive input, left channel inl - 15 negative input, left channel outl - 16 negative output terminal, left channel v ccl 17 supply voltage, left channel lgnd 20 ground, left channel SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 5 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 8. functional description the SA58632 is a two-channel btl audio ampli?er capable of delivering 2 1.5 w output power to an 8 w load at thd+n = 10 % using a 6 v power supply. it is also capable of delivering 2 2.2 w output power to an 8 w load at thd+n = 10 % using a 9 v power supply. using the mode pin, the device can be switched to standby and mute condition. the device is protected by an internal thermal shutdown protection mechanism. the gain can be set within a range of 6 db to 30 db by external feedback resistors. 8.1 power ampli?er the power ampli?er is a bridge-tied load (btl) ampli?er with a complementary pnp-npn output stage. the voltage loss on the positive supply line is the saturation voltage of a pnp power transistor, on the negative side the saturation voltage of an npn power transistor. the total voltage loss is < 1 v. with a supply voltage of 6 v and an 8 w loudspeaker, an output power of 1.5 w can be delivered to the load, and with a 9 v supply voltage and an 8 w loudspeaker an output power of 2.2 w can be delivered. 8.2 mode select pin (mode) the device is in standby mode (with a very low current consumption) if the voltage at the mode pin is greater than v cc - 0.5 v, or if this pin is ?oating. at a mode voltage in the range between 1.5 v and v cc - 1.5 v the ampli?er is in a mute condition. the mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor. the device is in active mode if the mode pin is grounded or less than 0.5 v (see figure 6 ). 8.3 btl/se output con?guration to invoke the btl con?guration (see figure 3 ), the btl/se pin is taken to logic high or not connected. the output differentially drives the speakers, so there is no need for coupling capacitors. the headphone can be connected to the ampli?er negative outputs using a coupling capacitor for each channel. the headphone common ground is connected to the ampli?er ground. to invoke the single-ended (se) con?guration (see figure 15 ), the btl/se pin is taken to logic low or connected to ground. the positive outputs are muted with a dc level of 0.5v cc . using a coupling capacitor for each channel, speakers can be connected to the ampli?er negative outputs. the speaker common ground is connected to the ampli?er ground. headphones can be connected to the negative outputs without using output coupling capacitors. the headphone common ground pin is connected to one of the ampli?er positive output pins. SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 6 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 9. limiting values 10. thermal characteristics [1] thermal resistance is 22 k/w with dap soldered to 64.5 mm 2 (10 square inch), 1 ounce copper heat spreader. 11. static characteristics table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage operating - 0.3 +18 v v i input voltage - 0.3 v cc + 0.3 v i orm repetitive peak output current - 1 a t stg storage temperature non-operating - 55 +150 c t amb ambient temperature operating - 40 +85 c v p(sc) short-circuit supply voltage - 10 v p tot total power dissipation hvqfn20 - 2.2 w table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air 80 k/w 64.5 mm 2 (10 square inch) heat spreader [1] 22 k/w r th(j-sp) thermal resistance from junction to solder point 3 k/w table 6. static characteristics v cc =6v; t amb =25 c; r l =8 w ; v mode = 0 v; measured in test circuit figure 3 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc supply voltage operating 2.2 9 18 v i q quiescent current r l = w [1] -1522ma i stb standby current v mode =v cc --10 m a v o output voltage [2] - 2.2 - v d v o(offset) differential output voltage offset - - 50 mv i ib input bias current pins inl+, inr+ - - 500 na pins inl - , inr - - - 500 na v mode voltage on pin mode operating 0 - 0.5 v mute 1.5 - v cc - 1.5 v standby v cc - 0.5 - v cc v i mode current on pin mode 0 v < v mode SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 8 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 13. application information 13.1 btl application t amb =25 c, v cc = 9 v, f = 1 khz, r l =8 w , g v = 20 db, audio band-pass 22 hz to 22 khz. the btl diagram is shown in figure 3 . pins 8, 9, 18 and 19 connected to ground. fig 3. application diagram of SA58632 btl differential output con?guration 002aac080 r2 50 k w SA58632 outl - inl+ inl - gnd svr outl+ mode 7 15 14 3 2 16 1 17 c3 47 m f r1 1 m f v il r l 100 m f 100 nf v cc 20 10 r4 50 k w outr - inr+ inr - outr+ 12 13 11 6 r3 1 m f v ir r l outr - btl/se 4 10 k w 10 k w gain left 2 r2 r1 ------ - = gain right 2 r4 r3 ------ - = SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 9 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 14. test information 14.1 static characterization the quiescent current has been measured without any load impedance ( figure 4 ). figure 6 shows three areas: operating, mute and standby. it shows that the dc switching levels of the mute and standby respectively depends on the supply voltage level. r l = w band-pass = 22 hz to 22 khz. (1) v cc =3v. (2) v cc =5v. (3) v cc =12v. fig 4. i q versus v cc fig 5. v o versus v mode fig 6. v mode versus v cc 10 20 30 i q (ma) 0 v cc (v) 020 16 812 4 002aac081 002aac089 v mode (v) 10 - 1 10 2 10 1 v o (v) 10 - 6 10 - 5 10 - 4 10 - 3 10 - 2 1 10 - 1 10 (1) (3) (2) 0 12 8 4 16 v mode (v) v cc (v) 016 12 48 002aac090 mute standby operating SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 10 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 14.2 btl dynamic characterization the total harmonic distortion-plus-noise (thd+n) as a function of frequency ( figure 7 ) was measured with a low-pass ?lter of 80 khz. the value of capacitor c2 in?uences the behavior of psrr at low frequencies; increasing the value of c2 increases the performance of psrr. p o = 0.5 w; g v =20db. (1) v cc =6v; r l =8 w . (2) v cc = 7.5 v; r l =16 w . v cc =6v; v o =2v; r l =8 w . (1) g v =30db. (2) g v =20db. (3) g v = 6 db. fig 7. thd+n versus frequency fig 8. channel separation versus frequency v cc =6v; r s =0 w ; v ripple = 100 mv. (1) g v =30db. (2) g v =20db. (3) g v = 6 db. fig 9. psrr versus frequency 002aac083 f (hz) 10 10 5 10 4 10 2 10 3 1 10 - 1 10 thd+n (%) 10 - 2 (1) (2) 002aac084 f (hz) 10 10 5 10 4 10 2 10 3 - 100 - 70 - 80 - 90 - 60 a cs (db) (1) (2) (3) 002aac085 f (hz) 10 10 5 10 4 10 2 10 3 - 60 - 40 - 20 psrr (db) - 80 (1) (2) (3) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 11 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 14.3 thermal behavior the measured thermal performance of the hvqfn20 package is highly dependent on the con?guration and size of the heat spreader on the application demo board. data may not be comparable between different semiconductors manufacturers because the application demo boards and test methods are not standardized. also, the thermal performance of packages for a speci?c application may be different than presented here, because of the con?guration of the copper heat spreader of the application boards may be signi?cantly different. philips semiconductors uses fr-4 type application boards with 1 ounce copper traces with solder coating. the demo board (see figure 23 ) has a 1 ounce copper heat spreader that runs under the ic and provides a mounting pad to solder to the die attach paddle of the hvqfn20 package. the heat spreader is symmetrical and provides a heat spreader on both top and bottom of the pcb. the heat spreader on top and bottom side of the demo board is connected through 2 mm diameter plated through holes. directly under the dap (die attach paddle), the top and bottom side of the pcb are connected by four vias. the total top and bottom heat spreader area is 64.5 mm 2 (10 in 2 ). the junction to ambient thermal resistance, r th(j-a) = 22 k/w for the hvqfn20 package when the exposed die attach paddle is soldered to 5 square inch area of 1 ounce copper heat spreader on the demo pcb. the maximum sine wave power dissipation for t amb =25 c is: thus, for t amb =60 c the maximum total power dissipation is: the power dissipation versus ambient temperature curve ( figure 10 ) shows the power derating pro?les with ambient temperature for three sizes of heat spreaders. for a more modest heat spreader using 5 square inch area on the top or bottom side of the pcb, the r th(j-a) is 31 k/w. when the package is not soldered to a heat spreader, the r th(j-a) increases to 60 k/w. 150 25 C 22 -------------------- - 5.7 w = 150 60 C 22 -------------------- - 4.1 w = SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 12 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er the characteristics curves ( figure 11 a and figure 11 b, figure 12 , figure 13 a and figure 13 b, and figure 14 ) show the room temperature performance for SA58632 using the demo pcb shown in figure 23 . for example, figure 11 p o w er dissipation v ersus output po w er (a and b) show the performance as a function of load resistance and supply voltage. worst case power dissipation is shown in figure 12 . figure 13 a shows that the part delivers typically 2.8 w per channel for thd+n = 10 % using 8 w load at 9 v supply, while figure 13 b shows that the part delivers 3.3 w per channel at 12 v supply and 16 w load, thd+n = 10 %. (1) 64.5 mm 2 heat spreader top and bottom (1 ounce copper). (2) 32.3 mm 2 heat spreader top or bottom (1 ounce copper). (3) no heat spreader. fig 10. power dissipation versus ambient temperature 2 4 6 p (w) 0 t amb ( c) 0 160 120 40 80 002aac283 (1) (3) (2) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 13 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er (1) v cc =6v. (2) v cc = 7.5 v. (3) v cc =9v. (1) v cc =6v. (2) v cc = 7.5 v. (3) v cc =9v. (4) v cc =12v. a. r l =8 w ; f = 1 khz; g v =20db b. r l =16 w ; f = 1 khz; g v =20db fig 11. power dissipation versus output power p o (w) 03 2 1 002aac288 1 2 3 p (w) 0 (1) (2) (3) 1 2 3 p (w) 0 p o (w) 04 3 12 002aac289 (1) (2) (3) (4) (1) r l =4 w . (2) r l =8 w . (3) r l =16 w . fig 12. worst case power dissipation versus v cc 002aac287 v cc (v) 012 8 4 0 3 2 1 4 p o (w) (1) (2) (3) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 14 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er (1) v cc =6v. (2) v cc = 7.5 v. (3) v cc =9v. (1) v cc =6v. (2) v cc = 7.5 v. (3) v cc =9v. (4) v cc =12v. a. r l =8 w ; f = 1 khz; g v =20db b. r l =16 w ; f = 1 khz; g v =20db fig 13. thd+n versus output power 002aac284 p o (w) 10 - 2 10 1 10 - 2 1 10 10 2 thd+n (%) 10 - 3 (1) (2) (3) 002aac285 p o (w) 10 - 3 10 1 10 - 2 10 - 2 1 10 10 2 thd+n (%) 10 - 3 (1) (2) (3) (4) thd+n = 10 %; f = 1 khz; g v =20db. (1) r l =4 w . (2) r l =8 w . (3) r l =16 w . fig 14. output power versus v cc 002aac286 v cc (v) 012 8 4 0 3 2 1 4 p o (w) (1) (2) (3) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 15 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 14.4 single-ended application t amb =25 c; v cc = 7.5 v; f = 1 khz; r l =8 w ; g v = 20 db; audio band-pass 20 hz to 20 khz. the single-ended application diagram is shown in figure 15 . if the btl/se pin is to ground, the positive outputs (outl+, outr+) will be in mute condition with a dc level of 0.5v cc . when a headphone is used (r l >25 w ) the se headphone application can be used without coupling capacitors by placing the load between negative output and one of the positive outputs (for example, pin 1) as the common pin. increasing the value of the tantalum or electrolytic capacitor c3 will result in a better channel separation. because the positive output is not designed for high output current (2 i o ) at the load impedance (< 16 w ), the se application with output capacitors connected to ground is advised. the capacitor value of c4/c5 in combination with the load impedance determines the low frequency behavior. the total harmonic distortion-plus-noise as a function of frequency was measured with a low-pass ?lter of 80 khz. the value of the capacitor c3 in?uences the behavior of the psrr at low frequencies; increasing the value of c3 increases the performance of psrr. pins 8, 9, 18 and 19 connected to ground. fig 15. se application circuit con?guration 002aac091 r2 100 k w SA58632 outl - inl+ inl - gnd svr outl+ mode 7 15 14 3 2 16 1 17 c3 47 m f r1 1 m f v il 100 m f 100 nf v cc 20 10 r4 100 k w outr - inr+ inr - outr+ 12 13 11 6 r3 1 m f v ir r l = 8 w outr - btl/se 4 10 k w 10 k w r l = 8 w c4 470 m f c5 470 m f gain left r2 r1 ------ - = gain right r4 r3 ------ - = SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 16 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er (1) v cc = 7.5 v. (2) v cc =9v. (3) v cc =12v. (1) v cc =9v. (2) v cc =12v. (3) v cc =15v. a. r l =4 w ; f = 1 khz; g v =10db b. r l =8 w ; f = 1 khz; g v =10db (1) v cc =9v. (2) v cc =12v. (3) v cc =15v. c. r l =16 w ; f = 1 khz; g v =10db fig 16. thd+n versus output power 002aac290 p o (w) 10 - 2 10 1 10 - 1 10 - 1 1 10 10 2 thd+n (%) 10 - 2 (1) (2) (3) p o (w) 10 - 2 10 1 10 - 1 002aac291 1 10 - 1 10 thd+n (%) 10 - 2 (1) (2) (3) 002aac292 p o (w) 10 - 2 10 1 10 - 1 10 - 1 1 10 10 2 thd+n (%) 10 - 2 (1) (2) (3) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 17 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er p o = 0.5 w; g v =20db. (1) v cc = 7.5 v; r l =4 w . (2) v cc =9v; r l =8 w . (3) v cc = 12 v; r l =16 w . v o =1v; g v =20db. (1) v cc =5v; r l =32 w , to buffer. (2) v cc = 7.5 v; r l =4 w . (3) v cc =9v; r l =8 w . (4) v cc = 12 v; r l =16 w . (5) v cc =5v; r l =32 w . fig 17. thd+n versus frequency fig 18. channel separation versus frequency r s =0 w ; v ripple = 100 mv. (1) g v =24db. (2) g v =20db. (3) g v = 0 db. thd+n = 10 %. (1) r l =4 w . (2) r l =8 w . (3) r l =16 w . fig 19. psrr versus frequency fig 20. p o versus v cc 002aac093 f (hz) 10 10 5 10 4 10 2 10 3 1 10 - 1 10 thd+n (%) 10 - 2 (1) (2) (3) 002aac094 f (hz) 10 10 5 10 4 10 2 10 3 - 100 - 40 - 60 - 80 - 20 a cs (db) (1) (2) (3) (4) (5) 002aac095 f (hz) 10 10 5 10 4 10 2 10 3 - 60 - 40 - 20 psrr (db) - 80 (1) (2) (3) 0.8 1.2 0.4 1.6 2.0 p o (w) 0 v cc (v) 016 12 48 002aac096 (3) (2) (1) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 18 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er thd+n = 10 %. (1) r l =4 w . (2) r l =8 w . (3) r l =16 w . fig 21. worst case power dissipation versus v cc 0 3 2 1 4 p (w) v cc (v) 016 12 48 002aac097 (1) (2) (3) SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 19 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 14.5 general remarks the frequency characteristics can be adapted by connecting a small capacitor across the feedback resistor. to improve the immunity of hf radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k w ); this creates a low-pass ?lter. 14.6 SA58632bs pcb demo the application demo board may be used for evaluation in either btl or se con?guration as shown in the schematics in figure 3 and figure 15 . the demo pcb is laid out for a 64.5 mm 2 (10 in 2 ) heat spreader (total of top and bottom heat spreader area). (1) v cc = 7.5 v. (2) v cc =9v. (3) v cc =12v. (1) v cc =9v. (2) v cc =12v. (3) v cc =15v. a. r l =4 w ; f = 1 khz; g v =10db b. r l =8 w ; f = 1 khz; g v =10db (1) v cc =9v. (2) v cc =12v. (3) v cc =15v. c. r l =16 w ; f = 1 khz; g v =10db fig 22. power dissipation versus output power 1 2 3 p (w) 0 p o (w) 0 1.6 1.2 0.4 0.8 002aac293 (1) (2) (3) p o (w) 0 2.4 1.6 0.8 002aac294 1 2 3 p (w) 0 (1) (2) (3) 0 1.2 0.8 0.4 1.6 p (w) p o (w) 0 1.6 1.2 0.4 0.8 002aac295 (1) (2) (3) xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 20 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er fig 23. SA58632bs pcb demo 001aae327 SA58632bs rev5 audio amplifier outl+ outr+ gnd vcc gnd gnd vcc outl - inl - inr - outr - vcc/2 mode gnd sel vcc btl/se 10 k w 10 k w 56 k w 56 k w 11 k w 11 k w 1 m f 47 m f 1 m f 1 m f 1 m f 100 m f SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 21 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 15. package outline fig 24. package outline sot910-1 (hvqfn20) references outline version european projection issue date iec jedec jeita sot910-1 sot910-1 05-10-11 mo-220 - - - - - - note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included unit a max mm 1 0.05 0.00 0.4 0.3 5.1 4.9 3.15 2.85 6.1 5.9 4.15 3.85 0.65 0.40 a 1 dimensions (mm are the original dimensions) hvqfn20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm terminal 1 index area b c 0.2 d d h e e h e 0.8 e 1 e 2 l v 0.1 w 0.05 y 0.05 2.4 4 y 1 0.1 0 2.5 5 mm scale c y c y 1 x b e 2 e 1 e e 1/2 e a c b v m c w m 6 1 11 16 20 17 710 e h d h 1/2 e b a d e l detail x a c a 1 terminal 1 index area SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 22 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 16. soldering 16.1 introduction to soldering surface mount packages there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 16.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow temperatures range from 215 cto260 c depending on solder paste material. the peak top-surface temperature of the packages should be kept below: moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): table 8. snpb eutectic process - package peak re?ow temperatures (from j-std-020c july 2004) package thickness volume mm 3 < 350 volume mm 3 3 350 < 2.5 mm 240 c+0/ - 5 c 225 c+0/ - 5 c 3 2.5 mm 225 c+0/ - 5 c 225 c+0/ - 5 c table 9. pb-free process - package peak re?ow temperatures (from j-std-020c july 2004) package thickness volume mm 3 < 350 volume mm 3 350 to 2000 volume mm 3 > 2000 < 1.6 mm 260 c + 0 c 260 c + 0 c 260 c + 0 c 1.6 mm to 2.5 mm 260 c + 0 c 250 c + 0 c 245 c + 0 c 3 2.5 mm 250 c + 0 c 245 c + 0 c 245 c + 0 c SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 23 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 16.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 16.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . table 10. suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 24 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. 17. abbreviations 18. revision history table 11. abbreviations acronym description btl bridge-tied load cmos complementary metal oxide semiconductor dap die attach paddle esd electrostatic discharge npn negative-positive-negative pcb printed-circuit board pnp positive-negative-positive rms root mean squared se single-ended thd total harmonic distortion table 12. revision history document id release date data sheet status change notice supersedes SA58632_1 20060627 product data sheet - - SA58632_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 01 27 june 2006 25 of 26 philips semiconductors SA58632 2 2.2 w btl audio ampli?er 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .semiconductors .philips .com. 19.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. philips semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local philips semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 19.3 disclaimers general information in this document is believed to be accurate and reliable. however, philips semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes philips semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use philips semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a philips semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. philips semiconductors accepts no liability for inclusion and/or use of philips semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale philips semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .semiconductors .philips .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by philips semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 20. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. philips semiconductors SA58632 2 2.2 w btl audio ampli?er ? koninklijke philips electronics n.v. 2006. all rights reserved. for more information, please visit: http://www.semiconductors.philips.com. for sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. date of release: 27 june 2006 document identifier: SA58632_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 power ampli?er . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 mode select pin (mode) . . . . . . . . . . . . . . . . . 5 8.3 btl/se output con?guration. . . . . . . . . . . . . . . 5 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 6 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 13 application information. . . . . . . . . . . . . . . . . . . 8 13.1 btl application . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 14.1 static characterization . . . . . . . . . . . . . . . . . . . 9 14.2 btl dynamic characterization . . . . . . . . . . . . 10 14.3 thermal behavior . . . . . . . . . . . . . . . . . . . . . . 11 14.4 single-ended application . . . . . . . . . . . . . . . . 15 14.5 general remarks . . . . . . . . . . . . . . . . . . . . . . . 19 14.6 SA58632bs pcb demo . . . . . . . . . . . . . . . . . 19 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 16.5 package related soldering information . . . . . . 23 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 25 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 19.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 19.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 20 contact information. . . . . . . . . . . . . . . . . . . . . 25 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 |
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